08:00

2019馬爾地夫奧臻島假期

05:44

2019馬爾地夫奧臻島潛水

04:02

馬爾地夫Ozen海豚

03:43

2019馬爾地夫奧臻島空拍

02:59

2019馬爾地夫奧臻島

03:55

2019馬爾地夫 奧臻島

09:42

[白癡之旅］史萊姆

03:57

白癡弟弟要住院了？！白癡弟弟😢😢我們全家都在祈禱你好起來啊！拜託🙏🏻醫生👨🏻‍⚕️治好牠！牠很天真無邪的🐶🐶🐶

01:59

麥塊#無趣之家哈哈哈哈哈哈哈哈哈哈哈😂

05:17

我不是化妝大人，但我有一點基礎！☺️☺️☺️

02:51

鹽城鹽芯微電Roller Type DAF Process

01:58

未拋光wafer film peeling Test

06:12

廣東X華Pre Cut DAF of SP600R:HP20VL RH Lamination Procedure Video

05:53

江蘇X芯Pre Cut DAF of SP600R:HP20VL RH Lamination Procedure Video

07:58

High Thermal Non Conductivity DAF60um For Copper Foil Lamination Procedure Video

06:26

20171106 New Roller Type DAF Wafer Backside Lamination Video

10:39

2017 Honghow Roller Type DAF Presentation

11:21

2017 Non Conductivity And Conductivity Roller Type DAF Process

05:17

Shanghai SIMAT Co , Ltd Conductivity & Non Conductivity Roller Type DAF

04:40

Low Cost Pre Cut DAF For Die Attach And Cu Pd WB Application音樂

03:42

SP600R1 150degC For Cu PdCu Pd Au WB Parameter And Result

02:07

HP20VL RH After Thermal Die Attach Chip Inside Voids Reason and solutionR

04:27

HP50VL Hight Temperature Wire Bonding Liquid DAF For Small Die Copper Wire Bonding Application

02:02

Copper Wire Bonding Ability Of Non Conductivity Type Liquid DAF HP50VL RH

01:56

20150808 SP600R For Small And Thin Package Application

02:04

Honghow C-DAF Thermal Die Attach Result R

01:14

High Thermal Pre Cut DAF Thermal Die Attach Result

01:33

Filler Free Conductivity Material

10:07

Extremely Low Cost DAF Product And Mount Technology

04:15

WBC SP700R&HP50VL RH DA And WB Parameter And Real Product Video R

03:10

Two Type Non Conductivity Film Double Coating Technology

00:56

SP600R UV WB 200 to 220degC Chip Sway Test

05:34

HP50VL Serial Multi Function Thermal Bonding Material

00:50

HP50VL Peeling test

01:00

SP600R UV Simuilation WB 220 to 240degc Sway Test

02:14

SP600R UV Layer 10um CoatingR3

04:20

HP50VL RH 多功能WBC and WFC Thermal Bonding Material

02:56

SP600R UV 100 percent UV Cure B Stage Silver WBC Film coating to die attach simulation test result

00:39

SP600R UVRDFor V8A Tape Peeling Test

02:09

HP50VL RH High temp and force B stage Elasticity adhesive BLT control Capability

03:05

8008NS and HP50VL RH Wire Bonding 180 to 260 C Sway Test

03:05

UV Lab Spin8 Can Coating Conductivity Type WBC Film Onto 12inch Wafer

01:58

WBC Stencil Printing Process

04:14

Diods SP700R And SP600R Conductivity WBC Film For MOSFET And Discrete Product Die Attach Applied

01:32

SP700R High Conductivity WBC Film For Low RDSon Die Attach Applied

01:34

HP50VL Simulation Wire Bonding Temp from 190 to 220deg Cdie size 800x1600um R

03:39

SP700RH High Thermal Conductivity WBC Film For MOSFET Die Size 920x750um Die Attach20140509

02:06

SP600R for PSR constant current LED Drive IC 9W85V 10W170V die attach result R

02:09

20140424 SP700RH for Die Size 800x900um Thermal Die Attach And Thermal Die Share Result

04:23

SP600R Die Size Over 3x3mm Low Voids Control TechnologyWith T Scan

09:45

Conductivity and Non conductivity Wafer Backside coating For Die Attach Applied

01:31

Taiwan 20140216

03:03

SP700RH coating to wire bonding Procedure Video

14:13

UV Lab Spin8 SP600R SP700RH HP20VLRH WBC Coating to Die attach Result

08:44

UV Lab spin 8SSP600R and HP20VL RH

04:25

UV Lab spin 8New MachineR

04:58

Laser Center aligner wafer center Tools

04:18

SP700RH WBC silver Film For Power Device Applied

11:02

Silver Conductivity & Non Conductivity WBC Process

05:38

SP600R UV LabSpib 8 for 8 inch wafer 20131001