35:52
AutoChip: Using LLMs to Automate IC Design
36:52
The Role of Machine Learning in Electronic Design Automation
33:12
Accelerating PCB design with AI
37:33
Finding the Needle in the Haystack - on the Use of AI in Defect Analysis
29:58
Big strides in electronics test and production using algorithmic methods to unsupervised ML
32:08
Infrastructure and Applications for AI in Semiconductor Test
32:08
Implementing Real-time AI in High Volume Test
34:28
Not Just Chips: Novel Techniques for IC Integration and Packaging Using Additive Technologies
16:30
Not just Chips: Metal Gel conductor offers increased durability for hard to soft interfaces in...
34:49
Not Just Chips: Retrospective on MEMS packaging - challenges to be considered / chalenges to be...
34:39
Not Just Chips: Packaging of Sensors for High Reliability, Survival and Performance in Extreme...
18:04
Not Just Chips: MEMS & Sensors Packagingand Interconnect - Session Overview and Introduction
21:14
Not Just Chips: Challenges to Develop a Reliable Lead Free Solder Column To Replace Solder...
35:35
Not Just Chips: Solving Moore’s law Packaging Challenges
34:37
Not Just Chips: Enabling high volume data communication – solving the new challenges in PIC wafer...
33:58
Not Just Chips: Silicon Photonics Chiplet Package - Optical Assembly
45:28
Not Just Chips: 3D IC Test Strategy
34:09
Not Just Chips: Assembly Solutions for Cost Effective Heterogeneous Integration with Disparate...
34:15
Not Just Chips: Signal Integrity Analysis at the Dawn of the Interposer Era
38:33
Not Just Chips: The Challenges of Scaling Beyond Moore’s Law and Into the World of 3DHI
59:49
Bringing sexy back to US heterogeneous integration manufacturing
58:49
Outlook for 2023: When and Where Will Growth Return? - Jan Vardaman
57:03
How is Industry Uncertainty Impacting MEMS Commercialization: Results of the Annual MEMS...
31:49
KGx - Paneldiscussion
27:28
KGx - Marc Hutner: Elevating KGD with Deep Data Analytics
40:14
KGx - Tom Katsioulas: Component-based supply chain provenance, traceability and digital thread of...
28:52
KGx - Jay Rathert: Quality Screening: Concepts and advances for using IC Manufacturing Defect...
23:26
Design Integration: Substrate Design Optimization for Chiplet Architecture
01:14:03
Paneldicussion: Design Integration : Current Status and Future Directions
23:05
Design Integration: Universal Chiplet Interconnect Express (UCIe)
27:40
Design Integration: Advanced Packaging Design Platform and Assembly Design Kit for Chiplets and...
51:27
Design Integration: Silicon Photonics Chiplet - Managing Design Integration
35:19
Design Integration: Systematic Identification of Key Design Factors for Chiplet Eco System Enabling
45:57
Design Integration - Marc Swinnen and Kenneth Larsen: Successful 3DIC Multi-Die Silicon System...
42:32
Design Integration - John Park: Design Challenges for 3D-ICs
39:00
Design Integration - Amy Lujan: Cost and Yield Analysis of Chiplet Packaging
28:42
Design Integration - Sujit Sharan: Heterogeneous Integration:The Role of Design in Putting the...
01:26:24
Paneldiscussion: Will successful Chiplet integration only happen with Testing Coopetition?
39:01
Heterogeneous Integration Testability - Abram Detofsky: The Heterogenous Integrated Product...
34:00
Heterogeneous Integration Testability - Bob Bartlett: The Changing Nature of Protocol based Testing
26:52
Heterogeneous Integration Testability - Will Thompson: Die and Probe Layout Strategies to Enable ...
29:44
Heterogeneous Integration Testability - Vineet Pancholi: Test Impact of Chiplets in Packages
31:56
Heterogeneous Integration Testability - Sameer Ruiwale: Test Economics in a Disaggregated-Die world
56:41
A Model for Workforce Development for the Semiconductor Industry
53:20
The Role of Semiconductor Packaging in the Drive Toward Sustainability: Words and Actions
57:29
Semiconductor Packaging and Assembly Trends: Outlook for 2022
36:30
Data and Test - Vinay Srihari: Cross-domain sharing of data and business logic with governance...
27:51
Data and Test - Michael Schuldenfrei: Quantifiable Assurance Hub - A practical Approach to...
34:17
Data and Test - Kimon Michaels: Leveraging semiconductor lifecycle data to drive closed-loop and...
32:55
Data and Test - Nir Sever: Lifetime performance and health monitoring of high bandwidth, die-to-...
29:17
Data and Test - Guy Cortez: Using Data Analytics to Debug and Trace Multi-Chip Module (MCM)...
50:16
Data and Test - George Harris: Test Impact of Chiplets in Packages
30:28
Data and Test - Ken Butler: The Road to Chiplets is Paved with Data
30:38
Data and Test - Terrence Tan: Debug and Fault Isolation Strategy as Industry moves to 3D...
34:33
Data and Test - Sreejit Chakaravarty: Chip-lets Interconnect Test Challenges
34:34
Data and Test - Jawad Nasrullah: Design of Heterogeneous Integrated Circuits - Testing...
27:26
Data and Test - Adam Cron: Fungible DFT: from Chiplets to Chip
32:22
Data and Test - Wu Yang: DFT for 3D IC-Challenges and Solutions
36:47
Data and Test - Adam Wright: Scalable Chiplet Interface Testing –Where We are andWhat We Need
34:53
Data and Test - Sergio Mier: Machine Learning in Semiconductors - A Balanced Approach
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