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About
Since 1996, TPT has designed and manufactured a range of manual and semi-automatic wire bonding machines.
TPT introduced the worlds first wire bonder capable of either Wedge or Ball bonding, simply by the change of its bond tool.
TPT bonders are used all over the world in Universities, Colleges, Institutes as well as by leading manufacturers of semiconductors, aersospace and medical devices, to name but a few.
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